Innovation

The project is a novelty and innovation on a national scale. It allows for the development of the assembly technology of elements on the FLEX flexible substrates, so that they can be safely used in applications requiring reliability and safety. These are currently one of the most important problems in the assembly technology of electronic systems. The innovative nature of the solutions developed in the project will have a positive impact on the policy of sustainable development. The new types of boards will enable manufacturers to make better use of the assembly space and improve ergonomics, through greater freedom of board arrangement and even greater miniaturization, while maintaining high reliability, performance and functionality compared to technology on rigid substrates. The proposed solution will help reduce the energy requirements of equipment and reduce the size of transport packaging. This will reduce waste. Increased reliability and miniaturization will also reduce demand for non-renewable natural resources used in electronics. The new technology will significantly reduce the weight of the devices using lighter substrates. As a result, the material consumption of manufacture will be reduced and energy demand will be decreased throughout the entire life cycle (production, transport, use and recycling processes). FLEX-PLUS technology will also make it possible to reduce the carbon footprint by reducing the weight of products, reducing energy consumption over the entire life cycle and by significantly increasing their lifetime.
Partners
Fundusze Europejskie
Rzeczpospolita Polska
Unia Europejska - Europejskie Fundusze Strukturalne i Inwestycjne

POIR.01.01.01-00-1083/17-00

Innovative technologies for assembling components on flexible FLEX substrates for critical applications, the Internet of Things and Industry 4.0