Technological objectives

Ensuring failure-free operation of electronic assemblies using flexible substrates in often unfavorable environmental conditions is a particularly important task for the project.

The current needs of the military, aviation (including space) and medical markets are focused on devices that monitor the life parameters of soldiers on the battlefield, pilots/astronauts when operating aircrafts/space shuttles, patients, both in hospitals and outside them.

Other needs relate to sensors, including climate sensors, which read parameters of other devices and transmit this data wirelessly to servers located in another, often very remote location. For these applications, standard flexible mounting technology is not sufficient as it does not meet the requirements for critical applications that require long and trouble-free operation, resistance to changing environmental conditions, radiation, vibration and overload.

The standard FLEX technology has been quickly adapted by the rapidly growing consumer electronics market, with applications such as flat screen TVs, mobile phones, tablets and smart bands. In the case of consumer electronics products, it is the costs per product that count first and foremost, and operational reliability is not taken into account as a priority factor in this case. The FLEX-PLUS mounting technology will provide a technological bridge between mastered FLEX board mounting technology and the rigid board mounting technology, which is practically fully characterized in terms of reliability.
Partners
Fundusze Europejskie
Rzeczpospolita Polska
Unia Europejska - Europejskie Fundusze Strukturalne i Inwestycjne

POIR.01.01.01-00-1083/17-00

Innovative technologies for assembling components on flexible FLEX substrates for critical applications, the Internet of Things and Industry 4.0