19th National Electronics Conference

Darłówko Wschodnie

The 19th National Electronics Conference took place in Darłówko Wschodnie on August 30 - 2/3 September 2020. The main organizer of the conference was the Gdynia Maritime University, continuing the tradition of scientific meetings started in 2002 by the Koszalin University of Technology.

Despite the prevailing pandemic, many scientists and engineers came from many areas of electronics and related fields (power electronics, automation, others). The subject of the conference included plan papers, poster sessions and special sessions in the field of:

  •  Optoelectronics
  •  Microelectronics and power electronics
  •  Metrology
  •  Technology and electronic circuits
  •  Broadband semiconductors

During the conference, participants could see the effects of work on the use of the 532 nm laser in the project "Innovative technologies for mounting elements on flexible FLEX substrates for critical applications, the Internet of Things and industry 4.0" (POIR.01.01.01-00-1083 / 17-00) . Paper presented by Piotr Ciszewski, entitled "The use of the 532 nm laser in the processing of printed circuits" was awarded by the Scientific Committee of KKE in the competition "Young scientists" in the thematic group Optoelectronics. The statement submitted to the KKE received a double, high review with a recommendation to publish the results in the Opto-Electronics Review journal.

The all-day special session of broadband semiconductors as part of KKE was chaired by our long-term employee, Dr. hab. Eng. Mariusz Sochacki, who is currently an expert in the implementation of the project "Innovative technologies for assembling elements on flexible FLEX substrates for critical applications, Internet of Things and industry 4.0" and was the co-author of the presented work on laser processing of printed circuits.

We congratulate both our scientists participating in the KKE and wish them further success.
Partners
Fundusze Europejskie
Rzeczpospolita Polska
Unia Europejska - Europejskie Fundusze Strukturalne i Inwestycjne

POIR.01.01.01-00-1083/17-00

Innovative technologies for assembling components on flexible FLEX substrates for critical applications, the Internet of Things and Industry 4.0