innovative technologies
for assembling components on flexible
FLEX substrates

News

Processing of printed circuit boards using a 532 nm green laser

Target market

Innovation

Technological objectives

Industrial research and development

Partners

Results

Events

30 August 2020

19th National Electronics Conference

archival
26 October 2019

Breakfast with the Beneficiarie
06 - 07 September 2018

26th International Defence Industry Exhibition MSPO

FLEX-PLUS technology allows for:

  • Miniaturizations of projects
  • Creating unusual shapes of electronic assemblies
  • Designing new personal electronics products and intelligent textiles, lighting technology or sensors
Partners
Fundusze Europejskie
Rzeczpospolita Polska
Unia Europejska - Europejskie Fundusze Strukturalne i Inwestycjne

POIR.01.01.01-00-1083/17-00

Innovative technologies for assembling components on flexible FLEX substrates for critical applications, the Internet of Things and Industry 4.0