Partners

The project is carried out in cooperation with the Tele and Radio Research Institute (ITR), which currently belongs to the Łukasiewicz Research Network and the Military Institute of Technology and Armament (WITU). The Łukasiewicz Research Network - Tele and Radio Research Institute is the most experienced institution in Poland, dealing with research and services related to printed circuit technologies, having been a pioneer in implementing innovative technologies of production and assembly of printed circuit boards for over 30 years. The institute produces flexible boards on polyimide laminate and rigid-flexible circuits. Naturally, the institute has become the best possible scientific-research partner. The realization of the project requires at the same time cooperation with a partner who has the ability to define guidelines, specifications of the final product and guarantees the possibility of testing the product in difficult environmental conditions or simply in the field. The target market for the FLEX-PLUS technology are, among others, military applications, which makes the Military Institute of Armament Technology in Zielonka another obvious project partner. Thanks to specialized research laboratories, allowing for certification of military products with the accreditation of the Polish Center for Accreditation and the accreditation of the Ministry of National Defense, the Institute has become a natural link between the company implementing advanced flexible circuit technology for critical applications and the target market of this technology. The experience of the staff and technological potential allows to test the developed solutions even in combat conditions. Flexible electronics tested in above-standard conditions specific for military applications will also be able to be adapted to medical, automotive, aviation or even space applications.
Partners
Fundusze Europejskie
Rzeczpospolita Polska
Unia Europejska - Europejskie Fundusze Strukturalne i Inwestycjne

POIR.01.01.01-00-1083/17-00

Innovative technologies for assembling components on flexible FLEX substrates for critical applications, the Internet of Things and Industry 4.0